Optimize your wafer dicing process with Dynatex's automatic scribe and break solutions. Our patented diamond scribe and break and break only systems can manage your diverse precision production needs.

DTX Scribe and Break

Leveraging patented technologies, Dynatex International's DTX Scribe and Break can manage the unique needs and diverse applications of customers that require a dry dicing process for die singulation and other critical applications.

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DTX Scribe and Break

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