Dynatex International is a world leader in wafer/diode die separation
products for semiconductor and related industries, providing fabless
services, equipment and materials.

Call 1.707.542.4227 to schedule a preview of our" Newly Released" technology for Debris Free™ laser dicing. Preview DTX Series equipment "now" for production thin silicon, solar cell manufacture and MEMs singulation. Go to: www.dynatex.info

PRODUCTS
Dry Process Dicing
— DTX Laser Scribe & Break
— DTX with DMas™
— DTX Breaker
— Dry Process Scriber
— Dry Process Breaker
— DXE Expander
— Hoops; Frames; Carriers
— Mylar Overlays
— Diamond Scribe Tools
— Download the Brochure

Wafer Dicing System
— KerfAid Lubricant/Coolant
— DXL Lubricant Injector
— Download the Brochure

Wafer Bonding System
— WaferGrip Thin Film Adhesives
— DXB Bonder
— Specialty Solvents
— Download the Brochure

SERVICES
— Contract Services
— Cleanroom
— Fabless Services

COMPANY
— About Us
— Contact Us
— News/Events

SOLUTIONS
Dry Process Solutions
— No Coatings Required
— Integrated Platform
— Best COO
— Debris Mangement™
— Dicing Narrow Streets
— Laser Bar Diode Separation
— Dicing Laser Scribed Streets

Wet Process Solutions
— Lapping; Grinding; Polishing
— Bonding Substrates
— Removing Adhesives
— Extending Blade Life
— PrecisionGrip Adhesives

SUPPORT
— Customer Support
— Application Notes
— MSDS
— Contact Support Group

WWW Dynatex International Site

-© 2004 Dynatex International. All rights reserved.