Dynatex International has been the leader in dry process dicing and wafer dicing materials since 1958. We are committed to provide solutions for die/diode dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator intervention.
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Innovation
With over five decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to assist you with your specific product requirements. Dynatex provides a complete line of die singulation products for dry process dicing, wafer bonding and saw dicing systems. These products are productivity enhancement tools for dicing silicon, gallium arsenide, thin film heads, flat panel displays, solid state lasers and other materials or products. Dry Process Dicing
If your application requires:
Requires chip-free results on GaAs, silicon, or difficult substrates such as those found in Biotech and Solar
Shrinks street sizes to maximize real estate
Requires no deionized water from the separation process
Requires a secure platform for dicing
Requires consistent, precise quality cuts to separate die
Requires increased throughput and volume
Requires breaking wafers that have been partially sawn or laser scribed
