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WaferGrip Temporary Adhesive Properties | Test Method | Standard WaferGrip | Conductive WaferGrip | High Temp WaferGrip |
Softening Point (°C/°F) | ASTM-D-36 | 98/208 | 98/208 | 115/239 |
Recommended Bond Temperature (°C/°F) | N/A | 100-120 / 212-248 | 100-120 / 212-248 | 120-140 / 212-284 |
Lap Shear Strength (psi) (Al to Al) | ASTM-D-1002 | 400 | 395 | 490 |
Ultimate Strength (psi/KPa) | ASTM-D-3574-E | 120/827 | 714/4922 | 517/3565 |
C.T.E -70°C to 49°C (μm/°C) | ASTM-E-831 | 133.3 | 140.0 | 147.9 |
Volume Resistivity (ohms-cm) | ASTM-D257 | 1.6E+14 | 8.8E+13 | 1.6E+14 |
% Volatiles | EPA Method 16 | Negligible | Negligible | Negligible |
Color | N/A | Blue | Purple | Green |
Santa Rosa, CA 95403-1048
Phone: 707-542-4227
Fax: 707-579-8590