WaferGrip™ Adhesives

WaferGrip Adhesives are advanced composite film adhesives engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.
  • Features
    WaferGrip Adhesives consist of Ethylene Vinyl Acetate (EVA) polymers. WaferGrip is heat activated to bond two surfaces together. A typical application is the bonding of wafers to mounting substrates for the thinning process. WaferGrip preformed shapes are manufactured to suit the required application. An accurately controlled bond line provides an efficient and robust process.

    WaferGrip preformed shapes are available in three formulations: Standard, Conductive and High Temp.

    WaferGrip Adhesives are available in three configurations:
    • WaferGrip on Release Paper, used for many standard applications including wafer dicing and wafer thinning.
    • WaferGrip on Polyester Film, used as a temporary substrate that allows the user to cut through the wafer into the substrate below.
    • WaferGrip on Double Sided Polyester Film.

    WaferGrip Adhesives are resistant to:
    • Water
    • IPA
    • Acetone
    • KOH etch solutions
    • Photoresist strippers
  • Process Method
    1. WaferGrip Adhesives are removed from the release paper then applied at room temperature to a mounting substrate such as sapphire or glass.
    2. The part or wafer is placed over the WaferGrip.
    3. The entire assembly is then heated to around 110°C/230°F for 30 to 60 seconds with light pressure, using a vacuum chamber for void free bonding.
    4. To remove WaferGrip, use our specially formulated solvent StripAid X Solvent.
  • Specifications


    Storage Temperature
    Store under cool, dry conditions away from direct sunlight. Proper storage temperatures range from –5°C/23°F to 24°C/75°F. For best results, keep unopened WaferGrip in the original sealed bag with desiccant. Shelf life at 25°C/ 77°F and 45% humidity is approximately 1.5 years.
    Thickness Options
    WaferGrip is available in the following thickness ranges:
    • 0.8 +/- 0.15 mil – 20 μm +/- 4 μm
    • 1.35 +/- 0.15 mil – 34 μm +/- 4 μm
    • 2.00 +/- 0.20 mil – 50 μm +/- 5 μm
    Product Specifications
    WaferGrip Temporary Adhesive Properties Test Method Standard WaferGrip Conductive WaferGrip High Temp WaferGrip
    Softening Point (°C/°F) ASTM-D-36 98/208 98/208 115/239
    Recommended Bond Temperature (°C/°F) N/A
    100-120 / 212-248
    100-120 / 212-248
    120-140 / 212-284
    Lap Shear Strength (psi) (Al to Al) ASTM-D-1002
    Ultimate Strength (psi/KPa) ASTM-D-3574-E
    C.T.E -70°C to 49°C (μm/°C) ASTM-E-831
    Volume Resistivity (ohms-cm) ASTM-D257
    % Volatiles EPA Method 16
    Color N/A
    Although the information and recommendations set forth herein are presented in good faith and believed to be correct, Dynatex International makes no representations as to their completeness or accuracy. Information is supplied upon the condition that the persons receiving will make their own verification and determination as to its suitability for their purposes prior to use. In no event will Dynatex International be responsible for damages of any nature whatsoever resulting from the use of or reliance upon this information. NO REPRESENTATION OR WARRANTIES, EITHER EXPRESSED OR IMPLIED, OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER NATURE ARE MADE HEREUNDER WITH RESPECT TO INFORMATION OR PRODUCT TO WHICH INFORMATION REFERS.
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