Dynatex offers a complete bonding system that comprises of WaferGrip Temporary Adhesive, StripAid X solvent and the DXB Wafer Bonders. The DXB Wafer Bonders provides a controlled process environment that is ideal for void free bonding.
The DXB 880 features an onboard process controller that automates the entire wafer bonding process. Key features include one-button operation and active cooling.
Santa Rosa, CA 95403-1048
Phone: 707-542-4227
Fax: 707-579-8590