Scribe and Break Consumables

Diamond Scribe Tools

Scribe tools are the essence of dry process dicing. Dynatex International diamond scribe tools are manufactured to a precision standard with close geometric tolerances. This translates directly into consistent scribing, and ultimately high yield in the production environment.

Low Tack Tape

Low tack tape is used to mount wafers for back end processes. Available in pre-cut squares or rolls, this medium is ideal for the saw dicing and scribe and break process. The low tack nature of the tape facilitates pick and place of even the smallest die. This product's ability to stretch allows the user to expand the diced wafer creating additional space between adjacent die, thereby simplifying the pick and place process.

Hoop Sets

Wafer handling systems are an integral part of establishing optimum yield. They minimize loss and maximize efficiency. When used with low tack tape and hoop carriers, Dynatex's hoop set forms a carrier and handling frame for the wafer. The hoop sets are reusable and available in a range of sizes.

Film Frames

A film frame is an efficient and reliable wafer handling solution suited for wafer storage and shipping.

Hoop Carriers

Our carriers are designed to safely carry and store wafers mounted on hoop sets.

Protective Overlays

Dynatex protective overlays are used for a variety of applications in the wafer processing and electronics manufacturing industry. The most common use is placement on top of wafers prior to expanding, after cleaving or die singulation.