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DXB 880 Series Wafer Bonder

DXB 880 Series Wafer Bonder

The automation introduced in the DXB 880 ensures a repeatable, robust process. The user is able to program each process node individually and with extreme precision, while new Active Cooling technology significantly reduces bonding cycle time. The system can be programmed with the desired temperature, pressure, and duration for each step in the sequence. The display shows the status of the bonding sequence as it progresses. The program is stored in local memory for easy access and simple operation, and can be password protected to prevent accidental changes.
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  • Features

    Features

    • The DXB 880 Automatic Wafer Bonder is used for creating void free wafer bonds.
    • Low total thickness variation (TTV) in bond line thickness.
    • Onboard process controller automates the entire wafer bonding process.
    • The DXB 880 has one button operation for a fully automated process.
    • Dual chamber technology provides precise control of the bonding pressure.
    • Active cooling feature allows the bond to set with the bonding pressure on, and provides a fast cycle time rather than the much longer time required for the bonder to cool on its own.
    • Heated vacuum chamber 11.25" diameter.
    • Available in two operating voltages – 120 VAC and 240 VAC both single phase.

    DXB-880 Series Wafer Bonder

    Active Cooling

    Active cooling is facilitated by the addition of a coolant channel directly in the heater base. Cooling takes between 6 to 10 minutes in a typical application. The following image shows the DXB 880's active cooling connections.

    DXB-880 Series Wafer Bonder Dual Chamber Operation

    Dual Chamber Operation

    For more controlled bonding processes, the dual chamber feature provides the best in control, precision and flexibility.

    The bonding pressure is controlled with extreme precision by adjusting the differential pressure in the two chambers. This allows the wafer to come up to temperature without trapping air in the bondline.

    Once the wafer is at temperature the force applicator can be lowered by reducing the vacuum in the lid. The differential between the two pressures provides the bonding pressure to the wafer.
  • Specifications

    Specifications

    Product Specifications
    DXB 880 Series DXB-880-01 DXB-880-02
    Bonding Chamber Size 11" (279 mm) Diameter
    		11" (279 mm) Diameter
    Temperature Range 100 - 356° F (40 - 180° C) 100 - 356° F (40 - 180° C)
    Cycle Time Range 1 min - 10 hrs 1 min - 10 hrs
    Power Required 100/120 VAC 10 amps, 50/60 Hz
    		220/240 VAC 5 amps, 50/60 Hz
    Vacuum Required 18 – 25 inHg 18 – 25 inHg
    Coolant Water (12 liters per minute, 40 PSI)
    		Water (12 liters per minute, 40 PSI)
    Environmental 60 - 80° F (15 - 27° C);
    0 - 95% Humidity (non-condensing)
    		60 - 80° F (15 - 27° C);
    0 - 95% Humidity (non-condensing)
    Dimensions Height: 26" (200 mm);
    Width: 14.7" (375 mm);
    Depth: 21.2" (440 mm);
    Chuck: 11.25" (285 mm)     		Height: 26" (200 mm);
    Width: 14.7" (375 mm);
    Depth: 21.2" (440 mm);
    Chuck: 11.25" (285 mm)
    Although the information and recommendations set forth herein are presented in good faith and believed to be correct, Dynatex International makes no representations as to their completeness or accuracy. Information is supplied upon the condition that the persons receiving will make their own verification and determination as to its suitability for their purposes prior to use. In no event will Dynatex International be responsible for damages of any nature whatsoever resulting from the use of or reliance upon this information. NO REPRESENTATION OR WARRANTIES, EITHER EXPRESSED OR IMPLIED, OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER NATURE ARE MADE HEREUNDER WITH RESPECT TO INFORMATION OR PRODUCT TO WHICH INFORMATION REFERS.
  • Applications

    Applications

    • Wafer Thinning
    • Wafer Lapping
    • Metal Plating
    • Wafer Polishing
    • Wafer Dicing
    • Deep Reaction Ion Etch
    • Any other temporary wafer bonding process
  • Downloads
Testimonials
We approached Dynatex International with a unique need of bonding a thin wafer to a thicker and robust wafer. Dynatex was the only company who offered this solution in a quick and efficient manner and also a competitively priced product. Additionally, Dynatex developed a custom process for our product and provided attentive and unlimited support for setting up and developing the process. They went above and beyond my expectations in terms of fast turnaround process development, tool lead time and cost savings.
Kierthi Swaminathan, Process Development Engineer, Power Integrations Inc.
 

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