DXB 525 Series Wafer Bonder

The DXB 525 is Dynatex's small footprint wafer bonder. Its compact size makes it ideal for experiments and small scale process development.
  • Features


    • Dual chamber technology allows the operator to manually adjust the bonding pressure.
    • Heated vacuum chamber 5.25" diameter.
    • On board timer is used to set the bonding process duration.
    • Available in two operating voltages – 120 VAC and 240 VAC (both single phase).
  • Specifications


    Product Specifications
    DXB 525 Series DXB-525-01 DXB-525-02
    Bonding Chamber Size 132 mm
    132 mm
    Temperature Range 100 - 320° F (40 - 160° C) 100 - 320° F (40 - 160° C)
    Cycle Time Range 1 sec - 10 min 1 sec - 10 min
    Power Required 100/120 VAC 5 amp, 50/60Hz;
    220/240 VAC 2.5 amp, 50/60Hz
    Vacuum Required 18 – 25 inHg 18 – 25 inHg
    Environmental 60 - 80° F (15 - 27° C);
    0 - 95% Humidity (non-condensing)
    60 - 80° F (15 - 27° C);
    0 - 95% Humidity (non-condensing)
    Dimensions Height: 7" (180 mm);
    Width: 9" (225 mm);
    Depth: 11.5" (290 mm);
    Chuck: 5.25" (135 mm)
    Height: 7" (180 mm);
    Width: 9" (225 mm);
    Depth: 11.5" (290 mm);
    Chuck: 5.25" (135 mm)
    Although the information and recommendations set forth herein are presented in good faith and believed to be correct, Dynatex International makes no representations as to their completeness or accuracy. Information is supplied upon the condition that the persons receiving will make their own verification and determination as to its suitability for their purposes prior to use. In no event will Dynatex International be responsible for damages of any nature whatsoever resulting from the use of or reliance upon this information. NO REPRESENTATION OR WARRANTIES, EITHER EXPRESSED OR IMPLIED, OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER NATURE ARE MADE HEREUNDER WITH RESPECT TO INFORMATION OR PRODUCT TO WHICH INFORMATION REFERS.
  • Applications


    • Wafer Thinning
    • Wafer Lapping
    • Metal Plating
    • Wafer Polishing
    • Wafer Dicing
    • Deep Reaction Ion Etch
    • Any other temporary wafer bonding process
We approached Dynatex International with a unique need of bonding a thin wafer to a thicker and robust wafer. Dynatex was the only company who offered this solution in a quick and efficient manner and also a competitively priced product. Additionally, Dynatex developed a custom process for our product and provided attentive and unlimited support for setting up and developing the process. They went above and beyond my expectations in terms of fast turnaround process development, tool lead time and cost savings.
Kierthi Swaminathan, Process Development Engineer, Power Integrations Inc.

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