Dry Process Dicing is the best solution for die singulation of high value and high volume devices such as laser diodes, MMICs, silicon photonics chips, MEMS, and biomedical chips (glass panels and sensors). Our precision diamond scribe system utilizes only 3-5 microns of the wafer street, allowing more die per wafer. Further, the exclusive patented breaking methods provide precise means of die separation while minimizing debris generation and mechanical stress on the die. Dry Process Dicing helps ensure better quality die and higher overall device yield, and lowers the costs of die singulation.
Santa Rosa, CA 95403-1048
Phone: 707-542-4227
Fax: 707-579-8590