Applications

Dry Dicing

Dry Process Dicing is the best solution for die singulation of high value and high volume devices such as laser diodes, MMICs, silicon photonics chips, MEMS, and biomedical chips (glass panels and sensors). Our precision diamond scribe system utilizes only 3-5 microns of the wafer street, allowing more die per wafer.

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Saw Dicing

The Wafer Dicing System provides an effective, integrated solution for improving saw dicing operations. Production managers and process engineers rely on the KerfAid Dicing Surfactant and the DXL Series Surfactant Dispenser to improve their production efficiency and product quality.

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Wafer Bonding

Dynatex's wafer bonding system prevents breakage, slipping warping and die fly-off during wafer dicing, polishing, grinding, head mounting and lapping operations.

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Wafer Expanding

The DXE Wafer Expander is the most efficient expander in the marketplace. Wafer expansion is primarily used to assist in the downstream pick and place process; our expanders provide a cost effective, easy to perform solution.

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