
Dry Dicing
Dry Process Dicing is the best solution for die singulation of high value and high volume devices such as laser diodes, MMICs, silicon photonics chips, MEMS, and biomedical chips (glass panels and sensors). Our precision diamond scribe system utilizes only 3-5 microns of the wafer street, allowing more die per wafer.More About Dry Dicing
Santa Rosa, CA 95403-1048
Phone: 707-542-4227
Fax: 707-579-8590