About Dynatex International

Leadership

Dynatex International has been the leader in dry process dicing and wafer dicing materials in a wide array of industries. We are committed to provide solutions for die/diode dicing and wafer processing applications and solutions designed to increase yields, maximize throughput, and minimize operator intervention.

Innovation

With over five decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to assist you with your specific product requirements. Dynatex provides a complete line of die-singulation products for dry dicing, saw dicing, wafer bonding, and wafer expanding processes. Dynatex products are designed with the end-user in mind with a focus on robustness and performance.