Wafer Bonding

Wafer bonding prevents breakage, slipping, warping and die fly-off during wafer dicing, polishing, grinding, head mounting and lapping operations. Dynatex's wafer bonding products provide a complete solution for the wafer bonding process.

Wafer Bonders

DXB Series Wafer Bonders are designed to bond wafers using WaferGrip Adhesives. Use of the DXB Series Wafer Bonder for mounting a wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.
Wafer Bonders
WaferGrip Adhesives

WaferGrip Adhesives

WaferGrip Adhesives are advanced composite film adhesives engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.

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StripAid Solvent

StripAid Solvent is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip. The non-hazardous formulation makes StripAid Solvent a popular choice for processes in which environmental impact is a particular concern.

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StripAid Solvent

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