Wafer Bonders

Dynatex offers a complete bonding system that comprises of WaferGrip Temporary Adhesive, StripAid X solvent and the DXB Wafer Bonders. The DXB Wafer Bonders provides a controlled process environment that is ideal for void free bonding.

DXB 525 Series Wafer Bonder

The DXB 525 is Dynatex's small footprint wafer bonder. Its compact size makes it ideal for experiments and small scale process development.

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DXB 525 Series Wafer Bonder
DXB 120 Series Wafer Bonder

DXB 120 Series Wafer Bonder

The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber, the DXB 120 supports larger wafers.

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DXB 880 Series Wafer Bonder

The DXB 880 features an onboard process controller that automates the entire wafer bonding process. Key features include one-button operation and active cooling.

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DXB 880 Series Wafer Bonder

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