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Sample Applications of The Dynatex Wafer Bonding System WaferGrip Thin Film Adhesives Seagate Technology, the largest manufacturer of disk drives, uses WaferGrip to bond wafers to the slice fixtures and bond bars to carriers for lapping purposes. Duane Schultz, Manufacturing Engineer, uses WaferGrip because it is hotmelt (EVA-based material) and easier to handle in large volume from a production standpoint. He said, "In our industry everything we do is measured in millionths of inches. Our specifications are more stringent than most. Volumes are so high we have a lot of chances to prove a product - 24 hours a day, 7 days a week, 365 days per year - WaferGrip is proven." Curtis Boatwright, Equipment Engineering Manager for Hudson Industries, a silicon wafer semiconductor manufacturer, uses WaferGrip and tack film. Blue tack is used on the majority of devices when they have very deep valleys. WaferGrip is used in the same manner but used on metalized wafers for flat mount. Mike Young, Process Engineer, at State of the Art manufactures high reliability surface mount chip resistors. He uses WaferGrip and Dynatex's bonder to dice polished thin film substrates into dies as small as .020"x .020". He chose Dynatex adhesives because, "Competitors glues did not hold small parts as securely, allowing more dice chipping due to vibration. Dicing waxes would not easily come off of the parts causing contamination issues." |
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