Dynatex International's products fit the unique needs of IC and laser manufacturers.

Dry Process Dicing™

Many emerging semiconductor technologies require a dry process to separate die effectively. The performance of these extremely sensitive chips is compromised when exposed to a wet dicing process. The Dynatex dry process solution is designed to work in clean room environments, eliminating the need for waste water disposal and improving the speed and efficiency of the dicing process. Perfect for III-V substrates and materials, like silicon-on-insulator, the scribe and break technique is the best alternative for high precision wafer die separation.

• Dry Process Dicing Application Note

• Merging Laser Scribe or Partial Sawing with the Dynatex Dry Process Breaker to Increase Throughput

Dynatex Wafer Bonding System and Wafer Dicing System

The semiconductor industry relies on numerous separation techniques. Dynatex offers a complete solution for saw-based wafer die separation and also provides equipment and materials to fit custom or proprietary techniques. The complete solution includes the WaferGrip™ adhesive for wafer bonding, diamond dicing blades, KerfAid™ coolant/lubricant, the KerfAid injection system, and specialty solvents.

• Dynatex Wafer Bonding System Sample Applications
• Dynatex Wafer Dicing System Sample Applications