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Integrating a Laser Scriber or a Partial Saw Cut with the GST Breaker Increases Throughput Dynatex International can integrate a laser scriber or dicing saw with a GST Breaker to separate die at high volume production levels. To meet the production speed required for optimal throughput at the lowest cost, the best practice is to partially cut wafers using two laser scribers, or two dicing saws, and then separate die with one GST Breaker. This solution saves in equipment cost and greatly improves the throughput of the laser scribe technology. The Dynatex's Contract Services Solutions Team proved that partially cutting the streets of a silicon wafer and breaking the partially sawed wafers to separate the die improved production speed and overall device yield then by die separation using saw dicing alone. The team then solved the high-speed production needs of separating III-V materials and MEMS by combining partial laser scribing with the fast and efficient Dynatex GST Breaker. In a MEMS application, since the streets of the MEMS wafer were not free of topside material, laser scribe technology was used to partially cut through the street debris and substrate. Then the wafer was transferred to one GST Breakers to separate the die. The Dynatex Soltutions Team saw that the combination of using two laser scribers and one GST Breaker provided a complete solution. The GST's non-contact breaking method does not interfere with delicate topside features characteristic to MEMS devices, whereas traditional sawing introduces swarf particles into the devices. Laser scribing all the way through the wafer was not an option because it was too slow for the targeted production speed. |
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