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Dynatex Dry Process Dicing Biostar uses Dynatex Scriber/Breaker to dice wafers into small die. According to Christie Schilling, Dynatex is about the only manufacturer that meets their requirements, because the process doesn't interfere with surfaces. She says, "The process used to break wafers is the best for our needs. That's really the only way." Dan Halpin of Skyworks Solutions (formerly Conexant), a top-ten North American semiconductor company focused exclusively on providing semiconductor products for communications electronics, uses the Dynatex Scriber/Breaker on finely ground, thin wafers. He says, "Our wafers are difficult to process because of grinding them to 5 mil thickness - this makes them harder to scribe and break than other wafers." Dynatex Wafer Dicing System & Wafer Bonding System Carla Camp, Production Manager at Voltage Multipliers: "We have been very satisfied with the product (KerfAid Lubricant)." Michael West, Process Engineer at Victoreen: "Dynatex's blades hold up two times better." Duane Schultz, Manufacturing Engineer at Seagate: "In our industry everything we do is measured in millionths of inches. Our specifications are more stringent than most. Volumes are so high we have a lot of chances to prove a product - 24 hours a day, 7 days a week, 365 days per year - WaferGrip is proven." Mike Young, Process Engineer, at State of the Art: "Competitors glues did not hold small parts as securely, allowing more dice chipping due to vibration. Dicing waxes would not easily come off of the parts causing contamination issues." |
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