From providing custom precision diamond dicing blades to breaking laser-scribed wafers, Dynatex provides solutions to manufacturers in all markets requiring wafer die or laser bar diode separation.

Dynatex Serves Numerous Markets

• Aerospace
• Automotive
• Biotech
• Emerging Markets
• Lighting
• Microelectronics
• Telecommunicatons
  • Fiber Optics
  • Optoelectronics
  • Wireless

Customer Support

For information on specific aspects of the support program, contact support1@dynatex.com or call Dynatex at +1.707.542.4227.