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In response to customer request, Dynatex International offers Contract Services to help manufacturers separate devices, solutions suitable for even the most involved die separation method.

Click here to send a quick email to our Santa Rosa sales office or go to our Info Request page for a more precise request.

Separation Solutions. Dynatex International has the solution for dicing diverse materials in specific production requirements. Dynatex expert engineers and cleanroom are available to provide superior services for dry process dicing and laser bar cleaving.

For III-V substrates, silicon wafers, hard materials including sapphire, glass and ceramics, and ultra clean devices, Dynatex Dry Process Dicing is the best process for separating devices in a 24/7 production environment. The Dynatex engineers have developed this fine-tuned process to achieve optimal speed when dicing narrow streets and to produce high device yields.

Emerging markets have considerable interest in Dynatex contract services because dry process dicing and non-contact breaking do not interfere with delicate topside features whereas traditional sawing introduces swarf particles into the devices. We developed various scribe methods and numerous break methods, even solutions for backlapping, among others, because traditional sawing wasn't producing high enough device yield. Sawing is fast, but not clean. Dry Process Dicing is both fast and clean.