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The Dynatex International cleanroom is capable of production quality turn-key operations. It is located in our Santa Rosa, CA office building. It is fully equipped for wafer die separation and laser bar cleaving.

Click here to send a quick email to our Santa Rosa sales office or go to our Info Request page for a more precise request.

Request a Sample. Dynatex International can process your wafer or laser bar in our cleanroom. Die separation is available for dry process dicing applications. Please contact us to run a sample or for engineering solutions for your specific application.

Press Release

Final Phase of Cleanroom Complete