Services

Contract Services

Contract Services

Contract Services provide manufacturers with customized wafer die separation and laser bar cleaving solutions.

Contract Services

Process Development

Dynatex International provides process development services for customers who purchase equipment. From wafer expanders and wafer bonders, to scribe and break machines, Dynatex will set up and optimize process and equipment parameters that meet the requirements of the customer's materials and end products.

Process Development Services
Process Development
Field Support

Field Support

Dynatex International field services and technical support are available to all customers. Support includes training, maintenance, emergency care, and expert identification of solutions for your wafer die separation needs.

Field Support Services

Contact Us

Call 707-542-4227 or send us a message below.
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