In response to customer request, Dynatex International offers Contract Services to help manufacturers separate devices, solutions suitable for even the most involved die separation method.
Contract Service
Dynatex International has the solution for dicing diverse materials in specific production requirements. Dynatex expert engineers and cleanroom are available to provide superior services for dry process dicing and laser bar cleaving.
For III-V substrates, silicon wafers, hard materials including sapphire, glass and ceramics, and ultra clean devices, Dynatex Dry Process Dicing is the best process for separating devices in a 24/7 production environment. The Dynatex engineers have developed this fine-tuned process to achieve optimal speed when dicing narrow streets and to produce high device yields.
Emerging markets have considerable interest in dry process dicing and non-contact breaking due to the lack of interference with delicate topside features while processing, whereas traditional sawing introduces swarf particles into the devices. Dynatex has developed various scribe methods and numerous break methods that produces higher device yield than traditional sawing. Sawing is fast, but not clean. Dry Process Dicing is both fast and clean.
Customer Support Program
Dynatex International field application services and technical support are available to all customers. Support includes training, maintenance, emergency care, and expert identification of solutions for your wafer die separation needs.
The support program includes the following:
Service call labor
Training classes
Hands on demonstrations
Scheduled maintenance
Customer service
Training Program
The training program consists of an educational mix of classroom and hands-on learning and can be tailored to your specific needs. The program can be geared for on-site attendance at your facility or at Dynatex’s corporate office in Santa Rosa, California.
