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Dynatex provides three solutions for separating die or diodes: Dry Process Dicing - ideal for III-V materials and wafers with topside features; Wafer Bonding System - secures wafers during wafer processing or dicing; and Wafer Dicing System - improves saw dicing operations.

Investigate Dry Process Dicing if your application:

• Requires chip-free results on GaAs, silicon, or difficult-to-manage substrates
• Shrinks street sizes to maximize real estate
• Requires no deionized water from the separation process
• Requires a secure platform for dicing
• Requires consistent, precise quality cuts to separate die
• Requires increased throughput and volume

Investigate Dynatex International's Wafer Bonding & Dicing Systems if your application:

• Requires a secure platform for dicing
• Requires consistent, precise quality cuts to separate die
• Requires chip-free results
• Benefits from reduced wafer surface temperature
• Requires a secure platform for precision machining