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For
Use with a Dicing Saw
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Downloads
Wafer
Dicing Brochure (pdf)
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The
KerfAid Lubricant is a concentrated, aqueous-based solution of wetting
agents and surfactants that reduces heat build up and moves swarf particles
away from the kerf during the dicing process. It is completely water soluble,
biodegradable and non-corrosive.
Providing
a stream of the KerfAid Lubricant to the blade during dicing will lower
the friction between the blade and the substrate, dissipate heat generated
by the friction and increase swarf dispersion.
Given
a potential for a 30% increase in blade life, improved cleanliness and
up to 60% reduction of chipping and cracking, KerfAid is a cost cutting,
yield improving solution.
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Substrate
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Ratio
Water/KerfAid
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Recommended
KerfAid Type
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Benefits
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GaAs,
InP and other softer materials
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80:1
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KA-101
KA-105
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Significant
improvement in blade life and number of cuts. Significant edge
quality improvement. Good cleaning.
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Silicon
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80:1
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KA-101
KA-105
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Reduced
chip outs. Moderate blade life improvement. Good cleaning.
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Ceramic
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75:1
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KA-101
only
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Good
cleaning.
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Silicon
Carbide
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75:1
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KA-101
only
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Good
cleaning.
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PRODUCT
FEATURES:
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Economical
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-
Increases die yield
- Extends blade life
- Prevents corrosion
- 80:1 dilution factor
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Environmental
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Biodegradable
- Nontoxic
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Versatile
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Safe for all substrates
- Compatible with all high speed
cutting saws
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Purity
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No
residue
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USAGE:
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Optimum
results will be achieved when KerfAid is diluted with water up
to 80:1. The delivery rate is monitored automatically when used
with the DXL Lubricant Injector System.
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TYPES:
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KA
-101 High cleansing formula, good for all substrates
KA -105 Low foaming formula, good for most substrates
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TYPICAL
PHYSICAL PROPERTIES:
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Specific
Gravity @ 25°C
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0.99-1.05
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Solubility
@ 25°C in Water, % by weight
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100
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Viscosity
@ 20°C, cst
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5.43
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Flash
Point, °C
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N/A
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Vapor
Pressure @ 25°C, mmHg
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23.8
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Volatiles
(EPA Method 24), wt %
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Negligible
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Surface
Tension @ 25 °C, mN/m
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31-36
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Color
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Pink
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Odor
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Mild
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