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Dynatex Wafer Dicing System Advantages

Wafer Dicing System


Die Separation

The stream of KerfAid treated deionized (DI) water delivered to the dicing operation reduces thermal stress, die edge damage and internal cracking, assuring long-term integrity of the devices being processed. Since KerfAid is a coolant and lubricant, both the dicing blade and the device benefit. As a coolant, KerfAid reduces heat caused by friction. As a lubricant, KerfAid lowers friction and surface tension, which increases swarf dispersion.

  • Reduces Surface Tension by 25-40 dynes/cm2. KerfAid allows more water into the kerf, dissipating heat generated by friction.

  • Bonds Water Molecules into the kerf and to the dicing blade, allowing better swarf dispersion and lubrication.

  • Prevents Swarf Accumulation on the dicing blade and in streets, minimizing chipping and internal cracking.

  • Extends Blade Life by up to 30%. The lubricated blade runs cooler, reducing metal fatigue and blade wear.

  • Improves Die Yield and Reliability from the reduced amount of chipping, cracking and consequent edge damage.

  • Eliminates Scrubbing after dicing.

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