WaferGrip Electrically Conductive Thin Film Adhesive

The WaferGrip™ Conductive Adhesive series of products are high performance, silver-filled EVA adhesives specially designed and formulated for surface mount applications in the thin film head, semiconductor and telecommunications industry. It is a unique temporary conductive adhesive that is EVA (ethylene vinyl-acetate) based.

Conductivity and Reduction of Electrostatic Discharge

The market demand for smaller, lighter and faster electronic products operating at lower voltages is increasing. Manufacturers of semiconductor ICs, disk drives, flat panel displays and other components must shrink their designs and modify manufacturing processes to meet these new specifications. Smaller designs often result in the devices being more susceptible to damage due to electrostatic discharge (ESD). An ESD can easily damage small component features and potentially ruin the device.

To minimize the potential for ESD during the manufacturing process, all process steps must be designed to ground the processing equipment and material being processed. When used to bond wafers to mounting substrates, WaferGrip™ Conductive Adhesive provides a ground path between the material being processed and the process substrate or process tool fixture.

Advantages of Temporary Adhesives

WaferGrip™ Conductive Adhesive is a unique, conductive, EVA-based temporary adhesive for surface mount applications. It can be used to bond wafers to other substrates during dicing, grinding, lapping and polishing operations. WCA offers many benefits: it is available in thin film sheets in various thickness and die sizes which makes it easy to work with, it is easily removed and does not alter the desired thickness of the final product; it reduces static discharge and allows for faster dicing speeds on smaller die due to its high shear strength.

Compatible with Existing WaferGrip Cleaning Systems

Many manufacturers are concerned about introducing new products and techniques into their existing process flow. As a member of the WaferGrip™ family of products, WCA is fully compatible with adhesive removal equipment used with current WaferGrip™ products.