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| Products Dry Process Dicing Bonding System Dicing System >vs.Wax Contract Services Fabless Services Contact Us Distributors Info Request Register |
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Bonding with the WaferGrip Adhesive WaferGrip is manufactured to a uniform film thickness for perfect parallel mounting and fast, one-step application. Unlike wax or tape adhesive methods that take more time to apply, may require special handling and can often plug blades, the pre-measured WaferGrip promotes easy clean up and delivers consistent results every time. Bonding
with the Wax
Wax cannot accurately control adhesive thickness - leaving voids, ridges, valleys and parallelism problems.Saw dicing with KerfAid treated DI water transports swarf particles away from the saw blade and out of the kerf. Relevant Links |
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