The PrecisionGrip Thin Film Adhesive is an advanced composite film adhesive engineered Temporary adhesion of parts for lapping, polishing, and machining (CNC). Precision Grip is a precision replacement to wax bonding (or Crystal Bond) of parts.

To use, Precision Grip is applied at room temperature to mounting substrate (glass, aluminum, etc.). The part to be machined is placed over the adhesive. The entire assembly is then placed on a hot plate or bonder that has been heated to the recommended bond temperature (listed above) for 20 to 30 seconds. Light pressure applied to part will aid seating and minimize air bubbles.

Removal is performed by heating up the substrate (and adhesive) and sliding the parts off. A final clean of the parts can be made with Dynatex International StripAid solvent.

PrecisionGrip is offered in various thicknesses and sizes, 1) as an adhesive on a polyester backing and 2) as an adhesive film on release paper. With WaferGrip Adhesive's high shear strength, devices as small as 2 mils squared can be processed without the die fly off.

After the part has been processed it can easily be stripped from the substrate by placing it in the WaferGrip Stripper (StripAid) for 10-45 minutes depending on the application. The parts should be stripped at 75-110°C. Rinse with isopropol (IPA) for 2-5 minutes if necessary.