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| Products Dry Process Dicing Bonding System >DXB Bonder Dicing System Contract Services Fabless Services Contact Us Distributors Info Request Register |
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Use of the DXB Bonder for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing. The DXB Bonder reduces the number of air bubbles that can form during the bonding process, improving bond quality to both hard surfaces and flexible substrates. Die are held tightly to the WaferGrip film, eliminating die fly-off and reducing blade damage. WaferGrip reduces backside chipping while increasing speed, accuracy and yield. A cycle period of 15-45 seconds completes the entire bonding operation making the process cost-effective. The DXB Bonder causes wafers to be pressed and heated against an adhesive layer on a substrate under a vacuum. Variable cycle time allows either a short (as little as a fraction of a second) cycle for thermoplastic materials, or up to a ten minute cycle for curing epoxies. The heated element of the DXB Bonder is precisely controlled to ensure process uniformity. |
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