Dry Process Dicing leverages the capabilities of a fine-tuned process, a durable machine with an automated Windows NT interface, and precision diamond scribe tools.

Dry Process Dicing™

Designed for optimal speed when dicing narrow streets on III-V substrates and hard materials, Dry Process Dicing is the best solution for high yield manufacturing. With a fast, user-friendly interface and fully programmable software, the process reduces downtime and human intervention. The precision diamond scribe tool scribes 3-5 microns of a 20 micron street, allowing more die per wafer, being efficient and economical. The breaking method provides a precise means of die separation with minimal debris, ensuring better quality cuts and a higher overall device yield.

• How Dry Process Dicing Works
• Comparison To Sawing

Dry Process Dicing Family of Products

Dry Process Dicing from Dynatex International is a complete solution that gets results. It starts with a well designed process, robust equipment, and precision tools. To ensure quality on a consistent basis, Dynatex International provides:

• Dry Process Scriber/Breaker
• DXE Expander
• Supplies
  • Diamond Scribe Tools
  • Mounting Hoops, Frames & Tape
  • Protective Overlays

See how other manufacturers use Dynatex Dry Process Dicing Solutions: Application Note 1.

Use the Dry Process Breaker to separate laser scribed or partially sawed wafers or diodes: Application Note 2.

Download the Dry Process Dicing Brochure (583KB pdf).