Leverages the capabilities of a fine-tuned process, by employing patented technologies to handle the unique need of each of our customers.
Dry Process Dicing™
Designed for optimal speed when dicing narrow streets on III-V substrates and hard materials, Dry Process Dicing is the best solution for high yield manufacturing. With a fast, user-friendly interface and fully programmable software, the process reduces downtime and human intervention. The precision diamond scribe tool scribes 3-5 microns of a 20 micron street, allowing more die per wafer, being efficient and economical. The breaking method provides a precise means of die separation with minimal debris, ensuring better quality cuts and a higher overall device yield.
A breaker only machine for wafers that have been sawn, etched or laser scribed. Dynatex offers two different types of patented breakers, each unique in meeting diverse needs in substrates up to 200 mm (or 8 inches).
This state of the art diamond scribe and break machine is the next generation in singulation. It combines both the scribe and break mechanisms into one machine as an efficient package for the clean room.
The most affordable and efficient expander in the marketplace. Wafer expansion is primarily used to assist in the downstream pick and place process, providing a complete process solution.
Dynatex offers a full range of products to ensure the best results from every process. Dynatex offers the highest quality diamond tools, tapes, mylar overlays, hoops, carriers, and spare parts for all products sold.
