Company Products Services Solutions Support Home

Products
Dry Process Dicing

Bonding System
Dicing System

Contract Services
Fabless Services

Contact Us
Distributors
Info Request
Register


Dry Process Dicing leverages the capabilities of a fine-tuned process, a durable machine with an automated Windows NT interface, and precision diamond scribe tools.

Dry Process Dicing


Scriber/Breaker

Dry Process Dicing™

Designed for optimal speed when dicing narrow streets on III-V substrates and hard materials, Dry Process Dicing is the best solution for high yield manufacturing. With a fast, user-friendly interface and fully programmable software, the process reduces downtime and human intervention. The precision diamond scribe tool scribes 3-5 microns of a 20 micron street, allowing more die per wafer, being efficient and economical. The breaking method provides a precise means of die separation with minimal debris, ensuring better quality cuts and a higher overall device yield.

Dry Process Dicing Family of Products

Dry Process Dicing from Dynatex International is a complete solution that gets results. It starts with a well designed process, robust equipment, and precision tools. To ensure quality on a consistent basis, Dynatex International provides:

See how other manufacturers use Dynatex Dry Process Dicing Solutions: Application Note 1.

Use the Dry Process Breaker to separate laser scribed or partially sawed wafers or diodes: Application Note 2.

Download the Dry Process Dicing Brochure (583KB pdf).

 


Email us
-© 2003 Dynatex International. All rights reserved.