The Dynatex Dry Process Dicing Scriber/Breaker™

Specification Link
GST Features

Downloads (pdf)

Dry Process Dicing Brochure

100mm Spec Sheet

150mm Spec Sheet

GST Scriber/Breaker

The GST equipment is automated using a Windows™ NT interface, ensuring consistency and speed. Once the test wafer or laser bar is calibrated, production wafers move quickly through the process with little production support. Within seconds of proper alignment, the GST processes the wafer or laser bar and is ready for more in a 24/7 production environment.

GST Features

GST Benefits

• Zero kerf loss allows higher die density on the wafer
• Superior yield and improved efficiency
• Increased production rates
• Chip free results
• Less residual stress
• No toxic water discharge
• No D.I. water costs
• More real estate; narrower street widths