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Specification
Link
GST Benefits
Downloads (pdf)
Dry
Process Dicing Brochure
100mm
Spec Sheet
150mm
Spec Sheet
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The
GST equipment is automated using a Windows™ NT interface, ensuring
consistency and speed. Once the test wafer or laser bar is calibrated,
production wafers move quickly through the process with little production
support. Within seconds of proper alignment, the GST processes the wafer
or laser bar and is ready for more in a 24/7 production environment.
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NT
Interface. With a Windows™ NT operating environment, the
GST provides a fast, user-friendly interface and fully programmable
software for all scribing and breaking parameters, including TrueAngle™
diamond tool positioning. The architecture is layered and based on
standard interfaces from both the computer and semiconductor industries.
The library includes interfaces for equipment components such as robots,
motion control, I/O and machine vision. The system offers substantial
machine operations flexibility with respect to custom functionality
and expandability.
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Automation.
Complete, automatic scribing and breaking
of many substrate materials.
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Integration.
System
integration allows easy hook-up and transport.
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Joystick
Control Tray. Machine control during setup and operation is easy
with the joystick, mouse, and keyboard.
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Table
and Stage Assembly.
The GST provides a robust and stable servomotor-controlled stage that
travels up to 10 inches per second with high-resolution encoders,
maintaining accuracy.
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PC
Access Door. The
PC Access Door provides convenience, putting the PC within easy reach
during operation.
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Stand
Alone.
The GST has a small footprint in the clean room (~32"W x 43"D
x 71"H or 813mm x 1092mm x 1803mm) and few external wires or
connections.
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Precision
Diamond Scribe Tools.
Manufactured with gem quality diamond tips, the scribe tools ensure
top quality scribe lines.
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Hoop
Sets & Mylar Overlays.
Hoops, Tape and Mylar Overlays can be used as a stand alone wafer
handling system or in conjunction with the Scriber/Breaker.
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CE
Certified.
The GST has passed RF emissions testing and safety testing according
to rigorous European standards.
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Easy.
Few operator adjustments are required when changing between wafer
types
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