How Dry Process Dicing™ Works

Using a gem quality diamond scribe tool, the GST equipment scribes a precision 3-5 micron scribe line along the narrow streets between die on the surface of the wafer or laser bar. From the bottom of the wafer, the breaking mechanism delivers an exact impact to the scribe line, held in place during impact either by an anvil on the surface of the wafer or with vacuum from the bottom side. The wafer breaks along the scribe line, cleanly separating the die.

Scribe Capabilities

• Continuous Scribe: primarily used to separate ICs.
• Skip Scribe: ideal for laser bar applications with a blocking feature.
• Edge Scribe: used for wafer cleaving.
• Up to 150mm: configured for material up to 150mm in diameter.

Breaking Methods

• Non-Contact Breaking: used to break wafers with delicate topside features (>7:1 die aspect ratio).
• Anvil Breaking: the conventional break method used for most scribe and break applications.
• Break Only: used on materials already scribed by either a laser or saw scribe.