The Dynatex Wafer Bonding System prevents breakage, slipping, warping and die fly-off during wafer dicing, polishing, grinding, head mounting and lapping operations.

The Dynatex Wafer Bonding System

The easy-to-handle WaferGrip™ Thin Film Adhesive is positioned between the wafer and mounting substrate or Mylar™ base. It is secured in place using either a hot plate or the DXB™ Bonder for improved processing cycle time and repeatability. With a uniform thickness, the WaferGrip adhesive bonds wafers as thin as 2 mils while maintaining maximum adhesion for post-bond processing. A heated solvent cleanly dissolves the adhesive, increasing high quality die yield without interrupting production routines.

• Comparison To Wax Adhesives

Wafer Bonding System Products

To ensure quality on a consistent basis, Dynatex International provides:

• WaferGrip™ Thin Film Adhesives
• DXB™ Bonder
• Specialty Solvents

Download the Wafer Bonding System Brochure (369KB pdf).