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Wafer Dicing System

Discounted Pricing for Custom Hubbed Dicing Blades

Variety of diamond grit sizes available to meet all your material needs.

  • Dynatex utilizes a specialized process for control of diamond distribution.
  • High quality metal alloys make up the hub and the blade allowing for superior bond strength and longer blade life.
  • Superior quality cuts

Blade Series

Grit

Materials

G

2-3um

  • GaAs
  • InP
  • Germanium
  • Specialty Silicon
  • P2T
  • Softer Materials

S

4-6um

  • Silicon
  • Germanium
  • Ferrite
  • Glass
  • P2T

C

10-20um

  • Ceramic
  • Alumina
  • Glass
  • FR-4

Z

25-35um

  • Ceramic
  • Glass
  • BGA

Wafer Dicing Family of Products

Dynatex International provides:

Download the Wafer Dicing System Brochure (304KB pdf).

 


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