Wafer Bonding

Prevents breakage, slipping, warping and die fly-off during wafer dicing, polishing, grinding, head mounting and lapping operations.




The Dynatex Wafer Bonding System

The easy-to-handle WaferGrip™ Thin Film Adhesive is positioned between the wafer and mounting substrate or Mylar™ base. It is secured in place using either a hot plate or the DXB™ Bonder for improved processing cycle time and repeatability. With a uniform thickness, the WaferGrip adhesive bonds wafers as thin as 2 mils while maintaining maximum adhesion for post-bond processing. A heated solvent cleanly dissolves the adhesive, increasing high quality die yield without interrupting production routines.

Comparison to Wax Adhesives

Void Free Wafer Bonding

Prevention of Backside Chipping


bonderWafer Bonding Products- DXB Bonder

Use of the DXB Bonder for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.


Wafer Bonding In Semiconductor Manufacturing

Learn more about the DXB Bonder



WaferGripWaferGrip Thin Film Adhesive

This advanced composite film adhesive is engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.

Learn more about the WaferGrip Thin Film Adhesive



StripAidStripAid™ Solvent

StripAid is specially formulated to remove WaferGrip adhesives, but can be used for other numerous applications. Because StripAid has a low order of toxicity, it does not require special handling.

Learn more about the StripAid Solvent

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