DTX Scribe and Break

Leveraging patented technologies, Dynatex International's DTX Scribe and Break can manage the unique needs and diverse applications of customers that require a dry dicing process for die singulation and other critical applications.
  • Features

    FEATURES

    The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.
    • High precision production and R&D tool
    • Integrated vision system provides simple automatic processing operations
    • User friendly GUI with touch screen operation for ease of operator interface
    • Wizard guided system calibrations
    • Windows 10 based software
    • Single adjustable monitor
    • Integrated scribe and break stages
    • Multiple break types/assemblies available
    • 200 mm wafer and partial wafer processing
    • Fully automatic and manual modes
  • Specifications

    Specifications

    Platform
    Wafer Size Up to 200 mm
    Base Plate Material Granite
    X Y Theta Actuators Linear motors
    X Y Stage Resolution 0.2 microns
    1 micron minimum step (accuracy)
    Theta Stage Resolution 0.001 degree
    Positioning System Feedback Mechanism Optical encoder
    Axis Controllers Dedicated controller per axis
    Stability Vibration free mounts
    Controller Communication Distribution RJ45 LAN - 100 MB/s Ethernet
    Allows for fastest MTTR, remote support/service and diagnostics, and process assistance
    Operator Interface Single touch screen monitor for fast and easy operation
    Enclosure Corrosion resistant steel
    Internal Access Lift off covers
    Safety Mechanically operated interlock switches
    Footprint 1.8 m2
    PM Schedule 6 months
    Process Module
    Diamond Type V-4-64
    Scribe Angle 28 to 40 degrees
    Can be set to sub -toe angles: 24 to 28 degrees
    Scribe Force Programmable force range: 2 grams to 200 grams
    Break Cycle Time >750 ms
    Z Axis Actuator Brushless DC servo motor
    Software
    Operating System Windows 10
    64 Bit, SSD Hard Drive standard
    Operator Interface GUI-based:
    Fully programmable process setup
    Interactive process modes
    Process Monitor Provides current process status
    Data Mining Move distance for servos, scribes, breaks, event logs, and calibrations performed
    Step Compensation Automatic Realignment of scribe and break actions
    Compensates for tape stretch and part movement during processing
    Theta Alignment Automatic wafer/piece alignment for each axis
    Pattern recognition vision system
    First Street Set Automatic set using vision
    Recipe Editor All parameters are stored in the recipe file or remotely via network
    Facilities
    Power 120 VAC 20 amp 50/60 Hz
    220 VAC 13 amp 50/60 Hz
    Power Input IEC 320
    Vacuum 15-27 in Hg, 0.5 CFM
    381-686 torr, 234 cm3/sec
    Air CDA, 0.4 - 0.6 MPA
    60 - 85 PSI
    Environment 60 – 80° F
    15 – 27° C
    Humidity 40 – 60 % Relative humidity (non – condensing)
    Footprint Width: 57", Depth: 50", Height: 78"
    Although the information and recommendations set forth herein are presented in good faith and believed to be correct, Dynatex International makes no representations as to their completeness or accuracy. Information is supplied upon the condition that the persons receiving will make their own verification and determination as to its suitability for their purposes prior to use. In no event will Dynatex International be responsible for damages of any nature whatsoever resulting from the use of or reliance upon this information. NO REPRESENTATION OR WARRANTIES, EITHER EXPRESSED OR IMPLIED, OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER NATURE ARE MADE HEREUNDER WITH RESPECT TO INFORMATION OR PRODUCT TO WHICH INFORMATION REFERS.
  • Applications

    APPLICATIONS

    The DTX Scribe and Break excels in dry dicing of high value and high volume devices, which produces quality die, high device yield, and lowers the overall costs of the die singulation process.
    • BioMedical devices with sensitive structures
    • BioMedical Glass with coatings
    • RFICs
    • Si-Photonics III-V chips
    • Laser diode cleaving and Matrix bar-to-die separation
    • OptoElectronics Devices
    • MEMS
    • LEDs
  • Downloads
Testimonials

I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system was pre-configured for wafer and chip dimensions that we had specified: a truly turn-key solution. We have been easily achieving mirror-like quality for laser facets with almost a 100% yield for the chip singulation. In addition, all our questions and concerns have been immediately addressed and we have never felt that we had to deal with technical problems alone. It is truly a pleasure to work with the Dynatex team and I strongly recommend their products to prospective buyers needing semiconductor wafer dicing equipment and/or services.

Arkadiy Lyakh, Assistant Professor, NSTC and CREOL, University of Central Florida
 

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