Dry Dicing

Dry Process Dicing is the best solution for die singulation of high value and high volume devices such as laser diodes, MMICs, silicon photonics chips, MEMS, and biomedical chips. Our precision diamond scribe system utilizes only 3-5 microns of the wafer street, allowing more die per wafer. Further, the exclusive patented breaking methods provide precise means of die separation while minimizing debris generation and mechanical stress on the die. Dry Process Dicing helps ensure better quality die and higher overall device yield, and lowers the costs of die singulation.

DTX Scribe and Break

The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, and Silicon, in substrate sizes up to 200 mm.

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DTX Scribe and Break
GSX - Refurbished GST

GSX - Refurbished GST

The GSX Series of Scribe and Break tools are factory refurbished GST systems. The GSX is upgraded with a new set of controllers and amplifiers, and runs on the highly advanced software of our flagship DTX Scribe and Break platform. The GSX is a cost effective way to extend and increase the life and performance of existing GST systems, or to get started using advanced dry dicing solutions for your R&D, pilot, and production programs.

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Scribe and Break Consumables

Dynatex offers a full range of products to ensure the best results from every process. We provide the highest quality  diamond tools, tapes, protective overlays, hoops, carriers, and spare parts for all products sold.

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Scribe and Break Consumables

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