We approached Dynatex International with a unique need of bonding a thin wafer to a thicker and robust wafer. Dynatex was the only company who offered this solution in a quick and efficient manner and also a competitively priced product. Additionally, Dynatex developed a custom process for our product and provided attentive and unlimited support for setting up and developing the process. They went above and beyond my expectations in terms of fast turnaround process development, tool lead time and cost savings.
Kierthi Swaminathan, Process Development Engineer, Power Integrations Inc.