Company Products Services Solutions Support Home


Company
News/Events
Contact Us
Distributors
Info Request
Register


Dynatex International is the leader in dry process dicing and wafer dicing materials. We are committed to provide solutions for die/diode dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator intervention.

Headquarters


News Feature

Introducing the
Model DTX
An integrated dry process dicing system.....click on the following link for information

www.dynatex.info


DRY PROCESS DICING

  • Laser Scribe
  • Diamond Scribe
  • Modular Break Options

NO COATINGS REQUIRED

DMas Debris Management Systems

Innovation. With over four decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to assist you with your specific product requirements. Dynatex provides a complete line of dicing tools and materials. Call or e-mail today to learn more about productivity enhancement tools for dicing silicon, gallium arsenide, thin film heads, flat panel displays, solid state lasers and other products.

Current release. The "Model DTX" is the first integrated laser system on the market for MEMs, Thin Silicon and Solar cell processing. This system showcases "DMas " revolutionary technology designed to prevent debris caused by laser processing.

Call 1 707 542-4227 to schedule a demonstration and process review.

International Service. Dynatex is committed to providing ongoing support services to our customers. We have developed a worldwide service and support network to address the needs of all our customers. Contact us or find a distributor near you.

 


Email us
-© 2003 Dynatex International. All rights reserved.