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Press Release. November 2002

Dynatex International Announces Fabless Services

Santa Rosa, California - November 4, 2002. In response to numerous customer requests to provide production quality fabless services for dry process die separation, Dynatex International announces its turn-key wafer die separation production facility as part of its Contract Services solution.

Unveiled in December 2001, Dynatex International Contract Services provides manufacturers with wafer die separation and laser bar cleaving engineering solutions for both traditional wet saw applications as well as dry process dicing applications. Coupled with the final phase completion of Dynatex International's clean room earlier this year, the Contract Services group now separates die for its customers.

For more information about Dynatex International's Fabless Services and wafer die separation products, please contact Dynatex at info@dynatex.com or +1.707.542.4227. Visit the Dynatex web site at www.dynatex.com.

About Dynatex International
Dynatex is the industry leader in Dry Process Dicing and manufacturer and provider of semiconductor dicing equipment and materials. The Company's corporate office is located in Santa Rosa, California.
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