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Final Phase of Cleanroom Complete Santa Rosa, California - June 3, 2002. Dynatex International announced that its final phase in developing its on-site cleanroom is complete. Planned in stages, Dynatex's cleanroom has been operational since 2001, helping customers solve process engineering questions, test scribe and break methodologies, and separate die. Now the cleanroom is capable of production quality turn-key operations. For III-V substrates, silicon wafers, hard materials including sapphire, glass and ceramics, and ultra clean devices, Dynatex Scribe/Break method is the best process for separating devices in a 24/7 production environment. The Dynatex engineers have developed this fine-tuned process to achieve optimal speed when dicing narrow streets and to produce high device yields. "We decided to offer our services and cleanroom because we found that companies in emerging markets repeatedly and successfully used our Scribe/Break technology to manage substrates or separate devices," said Leanne Schmidt, Vice President of Dynatex International. "We developed various scribe methods and numerous break methods, even solutions for backlapping, among others, because traditional sawing wasn't producing high enough device yield. Sawing is fast, but not clean. Dry Process Dicing is both fast and clean." For more information about Dynatex International's Contract Services and wafer die separation products, please contact Dynatex at info@dynatex.com or +1.707.542.4227. Visit the Dynatex web site at www.dynatex.com. About
Dynatex International |
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