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Press Release. February 2003

Dynatex International Develops Enhanced Software for MEMS Scribe & Break Die Separation

Santa Rosa, California - February 17, 2003. Dynatex International develops control software specifically for the MEMS industry. Now MEMS manufacturers can leverage all of the benefits of Dry Process Dicing, including no water contamination and no topside chipping, while scribing individual MEMS devices.

The problem with conventional scribing is that typically the tool scribes a continuous line from one edge of the wafer to the other. In this specific application the structures at the ends of the trench prevented the use of continuous scribing.

Dynatex developed a completely new method of scribing which enables the user to scribe locations on the wafer without compromising the integrity of the structures at the edge of the wafer.

This latest technological advancement is indicative of Dynatex International's commitment to providing leading edge solutions to established and embryonic manufacturing processes.

For more information about Dry Process Dicing, Dynatex International's Contract Services, or wafer die separation products, please contact Dynatex at sales1@dynatex.com or +1.707.542.4227. Visit the Dynatex web site at www.dynatex.com.

About Dynatex International
Dynatex is the industry leader in Dry Process Dicing and manufacturer and provider of semiconductor dicing equipment and materials. The Company's corporate office is located in Santa Rosa, California.
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